Phelma Formation 2022

Clean room based fabrication (UGA) - WPMWCRB7

  • Number of hours

    • Lectures 0
    • Projects 0
    • Tutorials 0
    • Internship 0
    • Laboratory works 0
    • Written tests 0

    ECTS

    ECTS 1.0

Goal(s)

Standard technologies front-end and back-end, CMOS for digitals and low-frequencies, FD SOI for low consumption, BiCMOS for high frequencies and millimeter waves analogs, silicon interposers for taking advantage of various technologies. Specific constraints for RF and millimeter waves consideration: dummies, coupling, back-end thickness. Alternative technologies: MEMS vs varactors. Alternative technologies: graphene and high mobility channels

Contact Florence PODEVIN

Content(s)

Trainings in a cleanroom environment will be practiced with 8 hours dedicated to the clean-room presentation and the fabrication of diodes or MOM capacitors.



Prerequisites

Basics in semi conductor

Test

Semester 9 - The exam is given in english only 

Lab report



Final mark= 100% lab report

Additional Information

Semester 9 - This course is given in english only EN

Course list
Curriculum->Double-Diploma Engineer/Master->Semester 9

Bibliography

  • R. Levy, “Microelectronic Materials and Processes.
  • C. Grovenor, “Microelectronic materials”.
  • G. Rebeiz, “RF MEMS, theory, Design , and Technologies, Wiley.
  • Mohamed Gad-el-Hak, “MEMS Introduction and Fundamentals”, The MEMS Handbook 2nd Ed.
  • J. Ramsden, “Nanotechnology, an introduction”, Elsevier.