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Our engineering & Master degrees

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Clean room based fabrication (UGA) - WPMWCRB7

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  • ECTS : 1.0

Goals

Standard technologies front-end and back-end, CMOS for digitals and low-frequencies, FD SOI for low consumption, BiCMOS for high frequencies and millimeter waves analogs, silicon interposers for taking advantage of various technologies. Specific constraints for RF and millimeter waves consideration: dummies, coupling, back-end thickness. Alternative technologies: MEMS vs varactors. Alternative technologies: graphene and high mobility channels

Contact Yannis LE GUENNEC

Content

Trainings in a cleanroom environment will be practiced with 8 hours dedicated to the clean-room presentation and the fabrication of diodes or MOM capacitors.



Prerequisites

Basics in semi conductor

Tests

Semester 9 - The exam is given in english only 

Lab report



Final mark= 100% lab report

Additional Information

Semester 9 - This course is given in english only EN

Curriculum->SEI->Semester 9
Curriculum->Double-Diploma Engineer/Master->Semester 9
Curriculum->Master->Semester 9
Curriculum->Master EEA WICS->Semester 9

Bibliography

  • R. Levy, “Microelectronic Materials and Processes.
  • C. Grovenor, “Microelectronic materials”.
  • G. Rebeiz, “RF MEMS, theory, Design , and Technologies, Wiley.
  • Mohamed Gad-el-Hak, “MEMS Introduction and Fundamentals”, The MEMS Handbook 2nd Ed.
  • J. Ramsden, “Nanotechnology, an introduction”, Elsevier.

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Date of update July 20, 2016

Grenoble INP Institut d'ingénierie Univ. Grenoble Alpes