Number of hours
- Lectures 12.0
- Tutorials 12.0
ECTS
ECTS 3.0
Goal(s)
Provide notions about electrochemical interfaces and durability in electrochemical generators.
TO SEE FICHE 3A-SIM 5PMMDVP0
Contact Fabien VOLPI
Content(s)
Packaging (12h00)
- The role of packaging in microelectronics.
- IC packaging, technologies (WB - wire-bonding, FC - flip chip, TAB - Tape Automated Bonding).
- Packaging families (SMP, THP,..), types (BGA, PQA, SIP, PGA,...) and packages (plastic, ceramic).
- Materials used in packaging (advantages and limits).
- Microsystem packaging.
- Description and study of physico-chemical and mechanical phenomena intervening in packaging process (thermodynamics, reaction kinetics, wetting,...).
- Study of particular cases of packaging.
Electrochemical generators (12h00)
- How electrochemical interfaces do influence the initial performances. Optimized electrode structure (PEMFC), dilatation, adhesion, stability (SOFC), metal-base electrodes (batteries).
- Systems durability. Intrinsic properties of the materials and their assembly. Effect of the operating conditions (temperature, load, etc.) on the durability.
TO SEE FICHE 3A-SIM 5PMMDVP0
Prerequisites
Teaching methods : Lectures
Lectures : Classes and assessment in English; Bibliography in English
TO SEE FICHE 3A-SIM 5PMMDVP0
Test
The exam is given in english only
Written exam
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Additional Information
This course is given in english only
Course list
Curriculum->Internationals Cursus->Semester 5
Curriculum->Master RI FAME->Semester 5
Bibliography
- Handbook of Batteries, D. Linden, T.B. Reddy, 3 ed, McGraw-Hill
- Handbook of fuel cells, H. A. Gasteiger et al. Eds, Vol. 1-4 (2003) & 5-6 (2009), Wiley
C.A. Harper, Electronic Packaging and Interconnection Handbook, 3d edition, McGraw-Hill, 2000. - J. Lau, C.P. Wong, J.L. Prince, W. Nakayama, Electronic Packaging: design, materials, process and reliability, McGraw-Hill, 1998.
- R.R. Tumala, Fundamentals of Microsystems packaging, Mack-Graw Hill, 2001