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Packaging and Durability - 5PMMPAC5

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  • Number of hours

    • Lectures : 6.0
    • Tutorials : 6.0
    • Laboratory works : 4.0
    • Projects : ?
    • Internship : ?
    ECTS : 1.5

Goals

Provide notions about the phycal chemistry of interfaces envolved during joining and assembly processes in electronics as well as in solid state electrochemical generators

Contact Fiqiri HODAJ

Content

I) Packaging (10h00)

  • The role of packaging in microelectronics.
  • IC packaging, technologies (WB - wire-bonding, FC - flip chip, TAB - Tape Automated Bonding).
  • Packaging families (SMP, THP,..), types (BGA, PQA, SIP, PGA,...) and packages (plastic, ceramic).
  • Materials used in packaging (advantages and limits).
  • Microsystem packaging.
  • Description and study of physico-chemical and mechanical phenomena intervening in packaging process (thermodynamics, reaction kinetics, wetting,...).
  • Study of particular cases of packaging.

II) Durability (6h00)

  • Principle of Solid Oxide Fuel Cell (SOFC)
  • Packaging : from elementary cell to stack
  • Economical aspects, present technological bolts and tendencies
  • Main role of used materials: electrolyte, cathode, anode, interconnects (advantages and limits)
  • Problems of SOFC operating at high temperature (durability)
  • Solutions: SOFC operating at intermediate temperature


Prerequisites

Thermodynamics, Surfaces-Interfaces, Phase diagrams, Electrochemistry

Tests

Semester 9 - The exam is given in english only 

Written exam: 2h (1h Packaging + 1h Durability)



Additional Information

Semester 9 - This course is given in english only EN

Curriculum->Master RI AMIS->Semester 9
Curriculum->Master RI EFM->Semester 9
Curriculum->SIM->Semester 9
Curriculum->Master RI FAME->Semester 9
Curriculum->Internationals Cursus->Semester 9
Curriculum->Degree Advanced Materials (AM)->Semester 9

Bibliography

Handbook of Batteries, D. Linden, T.B. Reddy, 3 ed, McGraw-Hill, 2001.
Handbook of fuel cells, H. A. Gasteiger et al. Eds, Vol. 1-4 (2003) & 5-6 (2009), Wiley.
C.A. Harper, Electronic Packaging and Interconnection Handbook, 3d edition, McGraw-Hill, 2000.
J. Lau, C.P. Wong, J.L. Prince, W. Nakayama, Electronic Packaging: design, materials, process and reliability, McGraw-Hill, 1998.
R.R. Tumala, Fundamentals of Microsystems packaging, Mack-Graw Hill, 2001.

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Date of update March 19, 2019

Grenoble INP Institut d'ingénierie Univ. Grenoble Alpes