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Our engineering & Master degrees
Our engineering & Master degrees

> Studies > Engineering degree

Durability _ ageing and packaging

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  • Number of hours

    • Lectures : 12.0
    • Tutorials : 12.0
    ECTS : 3.0

Goals

Provide notions about electrochemical interfaces and durability in electrochemical generators.

TO SEE FICHE 3A-SIM 5PMMDVP0


Contact Fabien VOLPI

Content

Packaging (12h00)

  • The role of packaging in microelectronics.
  • IC packaging, technologies (WB - wire-bonding, FC - flip chip, TAB - Tape Automated Bonding).
  • Packaging families (SMP, THP,..), types (BGA, PQA, SIP, PGA,...) and packages (plastic, ceramic).
  • Materials used in packaging (advantages and limits).
  • Microsystem packaging.
  • Description and study of physico-chemical and mechanical phenomena intervening in packaging process (thermodynamics, reaction kinetics, wetting,...).
  • Study of particular cases of packaging.

Electrochemical generators (12h00)

  • How electrochemical interfaces do influence the initial performances. Optimized electrode structure (PEMFC), dilatation, adhesion, stability (SOFC), metal-base electrodes (batteries).
  • Systems durability. Intrinsic properties of the materials and their assembly. Effect of the operating conditions (temperature, load, etc.) on the durability.

TO SEE FICHE 3A-SIM 5PMMDVP0



Prerequisites

Teaching methods : Lectures
Lectures : Classes and assessment in English; Bibliography in English

TO SEE FICHE 3A-SIM 5PMMDVP0

Tests

The exam is given in english only 

Written exam

TO SEE FICHE 3A-SIM 5PMMDVP0



Additional Information

This course is given in english only EN

Curriculum->Internationals Cursus->Semester 5
Curriculum->Master RI FAME->Semester 5

Bibliography

  • Handbook of Batteries, D. Linden, T.B. Reddy, 3 ed, McGraw-Hill
  • Handbook of fuel cells, H. A. Gasteiger et al. Eds, Vol. 1-4 (2003) & 5-6 (2009), Wiley
    C.A. Harper, Electronic Packaging and Interconnection Handbook, 3d edition, McGraw-Hill, 2000.
  • J. Lau, C.P. Wong, J.L. Prince, W. Nakayama, Electronic Packaging: design, materials, process and reliability, McGraw-Hill, 1998.
  • R.R. Tumala, Fundamentals of Microsystems packaging, Mack-Graw Hill, 2001

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Université Grenoble Alpes