School of engineering in Physics, Applied Physics, Electronics & Materials
Provide notions anbout electrochemical interfaces and durability in electrochemical generators.
* The role of packaging in microelectronics.
* IC packaging, technologies (WB - wire-bonding, FC - flip chip, TAB - Tape Automated Bonding).
* Packaging families (SMP, THP,..), types (BGA, PQA, SIP, PGA,...) and packages (plastic, ceramic).
* Materials used in packaging (advantages and limits).
* Microsystem packaging.
* Description and study of physico-chemical and mechanical phenomena intervening in packaging process (thermodynamics, reaction kinetics, wetting,...).
* Study of particular cases of packaging.
Electrochemical generators (12h00)
I - How electrochemical interfaces do influence the initial performances. Optimized electrode structure (PEMFC), dilatation, adhesion, stability (SOFC), metal-base electrodes (batteries).
II - Systems durability. Intrinsic properties of the materials and their assembly. Effect of the operating conditions (temperature, load, etc.) on the durabilit
The exam is given in english only
Written exam (1.5 h)
Handbook of Batteries, D. Linden, T.B. Reddy, 3 ed, McGraw-Hill
Handbook of fuel cells, H. A. Gasteiger et al. Eds, Vol. 1-4 (2003) & 5-6 (2009), Wiley C.A. Harper, Electronic Packaging and Interconnection Handbook, 3d edition, McGraw-Hill, 2000
J. Lau, C.P. Wong, J.L. Prince, W. Nakayama, Electronic Packaging: design, materials, process and reliability, McGraw-Hill, 1998.
R.R. Tumala, Fundamentals of Microsystems packaging, Mack-Graw Hill, 2001.