Phelma Formation 2022

Device and circuit reliability - 5PMNFCC0

  • Number of hours

    • Lectures 6.0
    • Projects 0
    • Tutorials 6.0
    • Internship 0
    • Laboratory works 0


    ECTS 1.0


In the microelectronics reliability context, understand the physics and the laws ruling the main failure mechanisms encountered in integrated circuit reliability, be able to perform a reliability analysis up to lifetime extrapolation based on experimental data

Contact Emmanuel VINCENT


  • Reliability context in semiconductor industry
  • Reliability basics remindser : reliability analysis basic concepts and tools for microelectronics reliability
  • Focus on main failure mechanisms in modern integrated circuits : phenomenological description and associated physics, methodologies and test structures, process reliability strategy
  • Addressed failure mechanisms : Gate Oxide Integrity, Mobile Ion Contamination, Hot-Carrier Injection, Bias Temperature Instability, Electromigration, Stress Migration
  • Application exercises

  • Semiconductor physics
  • Statistics


EVALUATION : Written exam 2h

100% écrit

Additional Information

Curriculum->Engineering degree->Semester 9
Curriculum->Double-Diploma Engineer/Master->Semester 9