Clean room based fabrication (UGA) - WPMWCRB7
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Goals
Standard technologies front-end and back-end, CMOS for digitals and low-frequencies, FD SOI for low consumption, BiCMOS for high frequencies and millimeter waves analogs, silicon interposers for taking advantage of various technologies. Specific constraints for RF and millimeter waves consideration: dummies, coupling, back-end thickness. Alternative technologies: MEMS vs varactors. Alternative technologies: graphene and high mobility channels
Contact Yannis LE GUENNEC
Content Trainings in a cleanroom environment will be practiced with 8 hours dedicated to the clean-room presentation and the fabrication of diodes or MOM capacitors.
PrerequisitesBasics in semi conductor
Tests Semester 9 - The exam is given in english only 
Lab report
Final mark= 100% lab report
Additional Information Semester 9 - This course is given in english only 
Curriculum->Double-Diploma Engineer/Master->Semester 9
Curriculum->Master->Semester 9
Curriculum->Master EEA WICS->Semester 9
Bibliography - R. Levy, “Microelectronic Materials and Processes.
- C. Grovenor, “Microelectronic materials”.
- G. Rebeiz, “RF MEMS, theory, Design , and Technologies, Wiley.
- Mohamed Gad-el-Hak, “MEMS Introduction and Fundamentals”, The MEMS Handbook 2nd Ed.
- J. Ramsden, “Nanotechnology, an introduction”, Elsevier.
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Date of update July 20, 2016