Phelma Formation 2022

Clean room based fabrication (UGA) - WPMWCRB7

  • Volumes horaires

    • CM 0
    • Projet 0
    • TD 0
    • Stage 0
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    Crédits ECTS

    Crédits ECTS 1.0


Fabrication process in clean-room. From sand to silicon wafer. Cleaning techniques. Material deposition: epitaxy, sputtering, chemical vapor deposition. Material transformation: wet and dry oxidation. Doping: diffusion, ionic implantation. Lithography. Chemical etching, physical etching, chemical mechanical polishing. Standard technologies front-end and back-end, CMOS for digitals and low-frequencies, FD SOI for low consumption, BiCMOS for high frequencies and millimeter waves analogs, silicon interposers for taking advantage of various technologies. Specific constraints for RF and millimeter waves consideration: dummies, coupling, back-end thickness. Alternative technologies: MEMS vs varactors. Alternative technologies: graphene and high mobility channels

Contact Florence PODEVIN


Trainings in a cleanroom environment will be practiced with 8 hours dedicated to the clean-room presentation and the fabrication of diodes or MOM capacitors.


Basics in semi conductor

Contrôle des connaissances

Semestre 9 - L'examen existe uniquement en anglais 

Lab report

Final mark= 100% lab report

Informations complémentaires

Semestre 9 - Le cours est donné uniquement en anglais EN

Cursus ingénieur->Double-Diplômes Ingénieur/Master->Semestre 9


  • R. Levy, “Microelectronic Materials and Processes.
  • C. Grovenor, “Microelectronic materials”.
  • G. Rebeiz, “RF MEMS, theory, Design , and Technologies, Wiley.
  • Mohamed Gad-el-Hak, “MEMS Introduction and Fundamentals”, The MEMS Handbook 2nd Ed.
  • J. Ramsden, “Nanotechnology, an introduction”, Elsevier.