Phelma Formation 2022

Packaging and Durability - 5PMMPAC5

  • Number of hours

    • Lectures 6.0
    • Projects 0
    • Tutorials 6.0
    • Internship 0
    • Laboratory works 4.0

    ECTS

    ECTS 1.5

Goal(s)

  • Give a general view of assembly processes in microelectronics
  • Present the main phenomena that intervene in these peocesses such as wetting, diffusion and interfacial reactivity
  • Provide the basic notions of the physico-chemistry of the interfaces involved during the different assembly processes in the electronic industry
  • Apply these knoledges to real packaging cases in electronic inductry
  • Provide notions of selection criteria of materials for electrolyte, cathode, anode, interconnects
  • Provide notions of durability in solid state electrochemistry
  • Give notions of economical aspects and technological bolts and tendencies
Contact Fiqiri HODAJ

Content(s)

I) Packaging (10h)

  • The role of packaging in microelectronics.
  • IC packaging, technologies (WB - wire-bonding, FC - flip chip, TAB - Tape Automated Bonding).
  • Packaging families (SMP, THP,..), types (BGA, PQA, SIP, PGA,...) and packages (plastic, ceramic).
  • Materials used in packaging (advantages and limits).
  • Microsystem packaging.
  • Description and study of physico-chemical and mechanical phenomena intervening in packaging process (thermodynamics, reaction kinetics, wetting,...).
  • Study of particular cases of packaging.

II) Durability (6h)

  • Principle of Solid Oxide Fuel Cell (SOFC)
  • Packaging : from elementary cell to stack
  • Economical aspects, present technological bolts and tendencies
  • Main role of used materials: electrolyte, cathode, anode, interconnects (advantages and limits)
  • Problems of SOFC operating at high temperature (durability)
  • Solutions: SOFC operating at intermediate temperature


Prerequisites

Thermodynamics, Surfaces-Interfaces, Phase diagrams, Electrochemistry

Test

Semester 9 - The exam is given in english only 

  • Normal session:
    Type of assessment: written exam (DS) + study cases (BE)

*Recoverable assessment:
Type of assessment: written exam
Duration: 2 hours
Authorized documents: all documents
Calculator: allowed
Possible remotely: no

  • Evaluation not recoverable: study cases
  • Second session:
    Type of assessment: written exam
    Duration: 2h
    Authorized documents: all authorized documents
    Calculator: allowed
    Possible remotely: no


Bureau d'étude : BE
Examen écrit session 1 : DS1
Examen écrit session 2 : DS2
N1 = note finale session 1
N2 = note finale session 2

En présentiel :
N1 = 80%DS1 + 20%BE
N2 = 80%DS2 + 20%BE

Additional Information

Semester 9 - This course is given in english only EN

Course list
Curriculum->Apprentissage MEP->Semester 9
Curriculum->SIM->Semester 9
Curriculum->Degree Advanced Materials (AM)->Semester 9
Curriculum->Internationals Cursus->Semester 9

Bibliography

Handbook of Batteries, D. Linden, T.B. Reddy, 3 ed, McGraw-Hill, 2001.
Handbook of fuel cells, H. A. Gasteiger et al. Eds, Vol. 1-4 (2003) & 5-6 (2009), Wiley.
C.A. Harper, Electronic Packaging and Interconnection Handbook, 3d edition, McGraw-Hill, 2000.
J. Lau, C.P. Wong, J.L. Prince, W. Nakayama, Electronic Packaging: design, materials, process and reliability, McGraw-Hill, 1998.
R.R. Tumala, Fundamentals of Microsystems packaging, Mack-Graw Hill, 2001.