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Packaging and Durability - 5PMMPAC5

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  • Number of hours

    • Lectures : 6.0
    • Tutorials : 6.0
    • Laboratory works : 4.0
    • Projects : 0
    • Internship : 0
    ECTS : 1.5


Provide notions about the phycal chemistry of interfaces envolved during joining and assembly processes in electronics as well as in solid state electrochemical generators

Contact Fiqiri HODAJ


I) Packaging (10h00)

  • The role of packaging in microelectronics.
  • IC packaging, technologies (WB - wire-bonding, FC - flip chip, TAB - Tape Automated Bonding).
  • Packaging families (SMP, THP,..), types (BGA, PQA, SIP, PGA,...) and packages (plastic, ceramic).
  • Materials used in packaging (advantages and limits).
  • Microsystem packaging.
  • Description and study of physico-chemical and mechanical phenomena intervening in packaging process (thermodynamics, reaction kinetics, wetting,...).
  • Study of particular cases of packaging.

II) Durability (6h00)

  • Principle of Solid Oxide Fuel Cell (SOFC)
  • Packaging : from elementary cell to stack
  • Economical aspects, present technological bolts and tendencies
  • Main role of used materials: electrolyte, cathode, anode, interconnects (advantages and limits)
  • Problems of SOFC operating at high temperature (durability)
  • Solutions: SOFC operating at intermediate temperature


Thermodynamics, Surfaces-Interfaces, Phase diagrams, Electrochemistry


Semester 9 - The exam is given in english only 

Part Packaging:
(i) Written exam, 1h. Seul document autorisé : 1 page A4 recto-verso manuscrite ; calculatrice autorisée
(ii)Oral presentation on a study case (20 minutes)

Part Durability : written exam. All documents allowed.

Partie packaging: 12/20 (dont examen écrit: 8/20 et étude des cas: 4/20)
Partie Durabilité: 8/20

Additional Information

Semester 9 - This course is given in english only EN

Curriculum->Master RI AMIS->Semester 9
Curriculum->Master RI EFM->Semester 9
Curriculum->SIM->Semester 9
Curriculum->Master RI FAME->Semester 9
Curriculum->Internationals Cursus->Semester 9
Curriculum->Degree Advanced Materials (AM)->Semester 9


Handbook of Batteries, D. Linden, T.B. Reddy, 3 ed, McGraw-Hill, 2001.
Handbook of fuel cells, H. A. Gasteiger et al. Eds, Vol. 1-4 (2003) & 5-6 (2009), Wiley.
C.A. Harper, Electronic Packaging and Interconnection Handbook, 3d edition, McGraw-Hill, 2000.
J. Lau, C.P. Wong, J.L. Prince, W. Nakayama, Electronic Packaging: design, materials, process and reliability, McGraw-Hill, 1998.
R.R. Tumala, Fundamentals of Microsystems packaging, Mack-Graw Hill, 2001.

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Date of update March 19, 2019

Université Grenoble Alpes