Packaging and Durability - 5PMMPAC5

I) Packaging (10h00)

• The role of packaging in microelectronics.
• IC packaging, technologies (WB - wire-bonding, FC - flip chip, TAB - Tape Automated Bonding).
• Packaging families (SMP, THP,..), types (BGA, PQA, SIP, PGA,...) and packages (plastic, ceramic).
• Materials used in packaging (advantages and limits).
• Microsystem packaging.
• Description and study of physico-chemical and mechanical phenomena intervening in packaging process (thermodynamics, reaction kinetics, wetting,...).
• Study of particular cases of packaging.

II) Durability (6h00)

• Principle of Solid Oxide Fuel Cell (SOFC)
• Packaging : from elementary cell to stack
• Economical aspects, present technological bolts and tendencies
• Main role of used materials: electrolyte, cathode, anode, interconnects (advantages and limits)
• Problems of SOFC operating at high temperature (durability)
• Solutions: SOFC operating at intermediate temperature

Thermodynamics, Surfaces-Interfaces, Phase diagrams, Electrochemistry

Semester 9 - The exam is given in english only 

Part Packaging:
(i) Written exam, 1h. Seul document autorisé : 1 page A4 recto-verso manuscrite ; calculatrice autorisée
(ii)Oral presentation on a study case (20 minutes)

Part Durability : written exam. All documents allowed.

Part Packaging: 12/20 (written exam: 8/20 + study cases: 4/20)
Part Durability: 8/20

Semester 9 - This course is given in english only 

Handbook of Batteries, D. Linden, T.B. Reddy, 3 ed, McGraw-Hill, 2001.
Handbook of fuel cells, H. A. Gasteiger et al. Eds, Vol. 1-4 (2003) & 5-6 (2009), Wiley.
C.A. Harper, Electronic Packaging and Interconnection Handbook, 3d edition, McGraw-Hill, 2000.
J. Lau, C.P. Wong, J.L. Prince, W. Nakayama, Electronic Packaging: design, materials, process and reliability, McGraw-Hill, 1998.
R.R. Tumala, Fundamentals of Microsystems packaging, Mack-Graw Hill, 2001.