Packaging and Durability - 5PMMPAC5

Goal(s)

• Give a general view of assembly processes in microelectronics
• Present the main phenomena that intervene in these peocesses such as wetting, diffusion and interfacial reactivity
• Provide the basic notions of the physico-chemistry of the interfaces involved during the different assembly processes in the electronic industry
• Apply these knoledges to real packaging cases in electronic inductry

Content(s)

• The role of packaging in microelectronics.
• IC packaging, technologies (WB - wire-bonding, FC - flip chip, TAB - Tape Automated Bonding).
• Packaging families (SMP, THP,..), types (BGA, PQA, SIP, PGA,...) and packages (plastic, ceramic).
• Materials used in packaging (advantages and limits).
• Microsystem packaging.
• Description and study of physico-chemical and mechanical phenomena intervening in packaging process (thermodynamics, reactive diffusion, reaction kinetics, wetting,...).
• Study of particular cases of packaging.

Thermodynamics, Surfaces-Interfaces, Phase diagrams

Test

Semester 9 - The exam is given in english only 

• Normal session:
  Type of assessment: written exam (DS) + study cases (BE)

*Recoverable assessment:
Type of assessment: written exam
Duration: 2 hours
Authorized documents: one A4 sheet of handwritten personal notes
Calculator: allowed
Possible remotely: no

• Evaluation not recoverable: study cases

• Second session:
  Type of assessment: written exam
  Duration: 2h
  Authorized documents: onbe A4 sheet of handwritten personal notes
  Calculator: allowed
  Possible remotely: no

Additional Information

This course brings 1.5 ECTS to students in Educational course (3P-MEP)

Bibliography

C.A. Harper, Electronic Packaging and Interconnection Handbook, 3d edition, McGraw-Hill, 2000.
J. Lau, C.P. Wong, J.L. Prince, W. Nakayama, Electronic Packaging: design, materials, process and reliability, McGraw-Hill, 1998.
R.R. Tumala, Fundamentals of Microsystems packaging, Mack-Graw Hill, 2001.