Aller au menu Aller au contenu
Our engineering & Master degrees


School of engineering in Physics, Applied Physics, Electronics & Materials
Science

Our engineering & Master degrees
Our engineering & Master degrees

> Studies

Packaging and Durability - 5PMMPAC5

A+Augmenter la taille du texteA-Réduire la taille du texteImprimer le documentEnvoyer cette page par mail cet article Facebook Twitter Linked In
  • Number of hours

    • Lectures : 6.0
    • Tutorials : 6.0
    • Laboratory works : 4.0
    • Projects : 0
    • Internship : 0
    ECTS : 1.5

Goals

Provide notions about the physical chemistry of interfaces involved during joining and assembly processes in electronics as well as in solid state electrochemical generators

Contact Fiqiri HODAJ

Content

I) Packaging (10h00)

  • The role of packaging in microelectronics.
  • IC packaging, technologies (WB - wire-bonding, FC - flip chip, TAB - Tape Automated Bonding).
  • Packaging families (SMP, THP,..), types (BGA, PQA, SIP, PGA,...) and packages (plastic, ceramic).
  • Materials used in packaging (advantages and limits).
  • Microsystem packaging.
  • Description and study of physico-chemical and mechanical phenomena intervening in packaging process (thermodynamics, reaction kinetics, wetting,...).
  • Study of particular cases of packaging.

II) Durability (6h00)

  • Principle of Solid Oxide Fuel Cell (SOFC)
  • Packaging : from elementary cell to stack
  • Economical aspects, present technological bolts and tendencies
  • Main role of used materials: electrolyte, cathode, anode, interconnects (advantages and limits)
  • Problems of SOFC operating at high temperature (durability)
  • Solutions: SOFC operating at intermediate temperature


Prerequisites

Thermodynamics, Surfaces-Interfaces, Phase diagrams, Electrochemistry

Tests

Semester 9 - The exam is given in english only 

Part Packaging:
(i) Written exam, 1h. Seul document autorisé : 1 page A4 recto-verso manuscrite ; calculatrice autorisée
(ii)Oral presentation on a study case (20 minutes)

Part Durability : written exam. All documents allowed.



Part Packaging: 12/20 (written exam: 8/20 + study cases: 4/20)
Part Durability: 8/20

Additional Information

Semester 9 - This course is given in english only EN

Curriculum->Internationals Cursus->Semester 9
Curriculum->Engineering degree->Semester 9

Bibliography

Handbook of Batteries, D. Linden, T.B. Reddy, 3 ed, McGraw-Hill, 2001.
Handbook of fuel cells, H. A. Gasteiger et al. Eds, Vol. 1-4 (2003) & 5-6 (2009), Wiley.
C.A. Harper, Electronic Packaging and Interconnection Handbook, 3d edition, McGraw-Hill, 2000.
J. Lau, C.P. Wong, J.L. Prince, W. Nakayama, Electronic Packaging: design, materials, process and reliability, McGraw-Hill, 1998.
R.R. Tumala, Fundamentals of Microsystems packaging, Mack-Graw Hill, 2001.

A+Augmenter la taille du texteA-Réduire la taille du texteImprimer le documentEnvoyer cette page par mail cet article Facebook Twitter Linked In

Date of update March 19, 2019

Université Grenoble Alpes